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Home » Products » Soldering Fluxes » Liquid Soldering Fluxes

Liquid Soldering Fluxes

Liquid Soldering Fluxes
Liquid Soldering Fluxes
Product Code : 01
Brand Name : NATIONAL PRODUCTS
Product Description

Liquid Soldering Fluxes

With having advanced technology based infrastructural support, we have emerged as a distinguished manufacturer of Liquid Soldering Fluxes for our large clientele. These types of soldering fluxes are suitable for spray, wave and dip soldering utilization purpose. We provide Liquid Soldering Fluxes in different packaging options that can be obtained at reasonable price range. Go through the below mentioned table that contains suitable grade of flux for specific applications.

LIQUID SOLDERING FLUXES

PRODUCT DESIGNATION

TECHNOLOGY

COLOUR

SPECIFIC GRAVITY

NOMINAL SOLID CONTENT

RECOMMENDED APPLICATION

ALCOHOL BASED

NP 207

Rosin - Containing

Clear amber

0.805

6 - 8%

Flux can be applied on component or printed circuit boards by dipping, brushing or spraying. Flux density should be maintained using "505’" solvent

NP 215F

Rosin - Containing

Clear amber

0.825

12%

Flux has excellent foaming properties and can be applied on printed circuit boards by foam, brushing or spraying. Flux density should be maintained using ‘’510’’ solvent.

NP 302 - series

No Clean

Colourless

0.82

2 - 3%

Surface mount devices and high density plated through hole assembly soldering for electronics and telecommunication applications. Flux density should be maintained using ‘’505’’ solvent.

NP 306

Rosin – containing No - Clean

Pale yellow

0.801

4%

Wave soldering, leaves a low level of non-tacky, non-corrosive residue. Flux density should be maintained using ‘’505’’ solvent.

NP 408N

Rosin - Free

Colourless

0.87 - 0.91

7%

Suitable for plating Nickel, Silver and Copper surfaces.

NP 800 - series

Rosin – Containing No Clean Halide Freen

Pale yellow

0.797 - 0.802

4 - 5%

Wave soldering, leaves a low level of non-tacky, non-corrosive residue. Flux density should be maintained using ‘’505’’ solvent.

NP 820

Rosin – Containing No Clean Halide Freen

Pale yellow

0.797 - 0.802

4 - 5%

Wave soldering, leaves a low level of non-tacky, non-corrosive residue. Flux density should be maintained using "505" solvent.

VOC FREE

NP 900

Rosin free, Water based, No- clean

Colourless

1.00

2.5%

Flux can be applied on printed circuit boards by foam, brushing or spraying.

HOT AIR LEVELLING

NP – Hot Air levelling Flux

-

Light pink

1.13

-

The flux can be applied on pre-cleaned PCBs by dip, roller-coating to brush.The flux has good thermal stability for use at solder bath temperature up to 260°C. After solder coating the flux residues are completely soluble in water; thus providing PCB,s with high ionic cleanliness

TINNING FLUX

NP – Tinning Flux

Water based

Colourless

1.05

15-20 %

The flux can be applied on pre-cleaned PCBs by dip, roller-coating to brush.

ALUMINIUM FLUX

NP – Aluminium flux

-

Amber to brown

1.35

-

Suitable for soldering of aluminium to aluminium, aluminium to copper, aluminium to brass and aluminium to plated terminals. NP-Aluminium Flux can be used with all conventional soldering techniques.


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